光照探头体积

A volume probe records the light incomming from all directions at many locations inside a volume.

The light is then filtered and only the diffuse light is recorded. The capture point positions are visible as an overlay when the Irradiance Volume object is selected.

如果物体不在任何辐射体积内部，或者间接光没有烘焙，将使用场景漫射光对其进行着色。

Tip

  • 在照亮室内环境时，尽量使栅格与房间尺寸一致。

  • 尽量不要在空白区域或者光照差异较小的区域添加过多的分辨率。

  • Bad samples can be fixed by adding a smaller grid near the problematic area.

  • Large scenes may require using many volumes with different level of details.

属性

参考

面板:

物体数据 ‣ 光照探头

强度

Intensity factor of the recorded lighting. Making this parameter anything other than 1.0 is not physically correct. To be used for tweaking, animating or artistic purposes.

Sampling Bias

Normal Bias

Offset sampling of the irradiance grid in the surface normal direction to reduce light bleeding. Can lead to specular appearance of diffuse surface if set too high.

View Bias

Offset sampling of the irradiance grid in the viewing direction to reduce light bleeding. Can lead to view dependant result if set too high. Prefer this if camera is static.

Facing Bias

When set to zero, avoids capturing points behind the shaded surface to bleed light onto the shaded surface. This produces non-smooth interpolation when the capture resolution is high. Increasing this bias will make the interpolation smoother but also introduce some light bleeding.

有效性 & 扩张

During the baking process, a validity score is assigned to each capture point. This score is based on the number of back-faces hit when capturing the incoming lighting. Only materials with Single Sided turned on for Light Probe Volumes will reduce the validity score.

有效性阈值

Capture points with validity below this threshold will be ignored during lighting interpolation. This remove the influence of capture points trapped inside closed geometry, reducing the artifacts they produced.

扩张阈值

Capture points with validity below this threshold will have their data replaced using valid neighbors.

半径

Radius in capture points in which to search for a valid neighbor.

烘焙

Light probe volume light data is static and needs to be manually baked. Once baked, the data is stored inside the object data-block and can be moved, animated and linked between blender files.

Note

Baking uses the render visibility of the objects in the scene.

During baking, the scene is converted into a different representation to accelerate light transport. This representation can be very memory intensive and prevents baking if it cannot fit inside the GPU memory. There are a few way to deal with this issue:

  • Larger scenes should be divided into smaller sections or use different level of details.

  • 降低 点面元精度。

  • Turn off the light probe volume visibility option on objects that have little to no effect in the bake.

Tip

The internal scene representation can be inspected using the Debug Value 3, 4 and 5.

分辨率

分辨率 X、Y、Z

Spatial resolution for volumetric light probes is determined per probe. The local volume is divided into a regular grid of the specified dimensions. The lighting will be captured for each cell in this grid.

烘焙采样

Number of ray directions to evaluate when baking. This increases the baking time proportionally to the size of the scene representation.

点面元精度

Number of surfels to spawn in one local unit distance. Higher values increase quality, but have a huge impact on memory usage.

Tip

A good value is twice the maximum Resolution.

捕获

捕获距离

Distance around the light probe volume that will be captured during the bake. A distance of 0 will only considered the inside of the volume.

World Contribution

烘焙来自世界的入射光，而不仅仅是更精确的照明的可见性，但会失去与周围辐射体积的正确混合。

Indirect Light Contribution

Capture light bounces from light source.

Emission Contribution

Capture emissive surfaces when baking.

钳制

直接光

Clamp incoming direct light. 0.0 disables direct light clamping. Here direct light refers to the light that bounces only once (from the light object) or light coming from emissive materials.

间接光

Clamp incoming indirect light. 0.0 disables indirect light clamping. Here indirect light refers to the light that bounces off a surface after the first bounce (from the light object) or during the first bounce if the light comes from emissive materials.

Tip

Setting Clamp Indirect to a very non-zero value will effectively only record the first light bounce leading.

偏移量

In order to reduce artifacts caused by bad capture point positioning, the bake process adjusts their location before capturing light. It moves the capture points slightly away from surrounding surfaces and tries to move them out of objects if they are not too far bellow the surface.

表面偏移

Distance to move the capture points away from surfaces.

搜索距离

Distance to search for valid capture positions if the capture point is near the back-face of a single-sided object.

Note

Only materials with Single Sided turned on for Light Probe Volumes will move capture point position.

视图显示

数据

Show the captured light using small diffuse spheres of the given size.

影响

在3D视图中显示影响边界。靠内的边界是衰减开始的地方。

范围限制

在3D 视图中显示裁减距离。