2.4.5. Package

Then you need to create the Package for the LMV321LILT, which is called SOT23-5. After specifying some metadata (like you already did for other library elements), you are asked to specify all pads of the Package. The SOT23-5 has 5 pads which we just name from 1 to 5:

Create Package Pads

After that, you can start drawing the footprint of the Package. It’s recommended to start with the pads:

Create Package

And then add other graphical items like the outline, name and value:

Create Package Graphics

That is already enough for a simple footprint.

Package Conventions

For details about how Packages should be designed, please take a look at our Package Conventions. The most important rules are:

  • Create generic packages, not specific ones. For example DIP08 is DIP08 — no matter whether it’s an OpAmp, an EEPROM or a microcontroller.

  • The origin (coordinate 0,0) should be in the center of the Package body.

  • Footprints must be drawn from the top-view. When a footprint needs to appear on the bottom of a board, this can be done in the board by mirroring it.

  • Add all pads of a package, not only the one you currently need. For example if the package has a thermal pad, you should add it, even if you currently don’t need it.

  • Name pads according IPC-7351 (if applicable; see section Library Conventions for more information), typically just 1, 2, 3 etc. Only name pads according their electrical purpose (e.g. Gate) if the Package is very specific for a particular purpose.

  • Pin 1 should always be at the top left.

  • There should be text elements for {{NAME}} and {{VALUE}}.